The DigiTimes server provides additional information regarding iPhone 6. According to his latest information, TSMC should continue to make sensors Touch ID using 8-inch wafers and componenty will be imported to him by other manufacturers. So his new claim is the exact opposite of what he announced in January. DigiTimes announced at the time that TSMC would begin production Touch ID pre iPhone 6 using 12-inch wafers and the entire production will take place directly in its factory.
TSMC etc Apple they eventually backed away from this plan due to concerns about the low profitability of the new production process. According to the information at the time, TSMC was to use 12-inch wafers and produce the chips with a 65-nm process, and the entire production would take place under its roof. However, according to information, with the use of new wafers there is only a 70-80% yield, while with the current process we encounter up to 95% yield. Apple therefore, he decided to stick with the old, tried and true method of TSMC making chips that would go to Xintec and China WLCSP. These will take care of creating the final shape of the sensor Touch ID.
- Read also: DigiTimes: TSMC to start production Touch ID pro iPhone 6 already in the second quarter of this year
As a Slovak would say….. Keep going….