On the occasion of the 20th anniversary of the iPhone Apple According to ETNews, Apple is working on several major technological innovations. One of them is supposed to be Mobile High Bandwidth Memory (HBM). This type of memory, which is known from powerful AI servers and GPU platforms, could push the capabilities of the iPhone to a whole new level. HBM is a type of DRAM that vertically stacks memory chips and connects them using microscopic channels called TSVs (Through-Silicon Vias). This will increase the transfer speed many times over, while consuming less power.
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Apple is considering using mobile HBM in combination with the iPhone's GPU, which would allow large AI models to be run directly on the device. Apple has already held initial talks with suppliers such as Samsung Electronics and SK hynix, according to the report. Mass production of these modules is expected after 2026. However, implementation will not be easy. The production of HBM memories is significantly more expensive than conventional LPDDR solutions. In addition, stacking chips into three-dimensional layers will have high demands on heat dissipation and overall accuracy. This can be problematic for thin iPhone bodies. Nevertheless, HBM could be the technology that will be the breakthrough for the anniversary iPhone.
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