Close ad

Technologies develop very quickly and while we expect iPhone 6s, companies are slowly starting to prepare technologies suitable for next year's model, iPhone 7. Next year's generation could bring some major improvements; among other things, there is speculation about dropping the traditional one Home Button in favor Touch ID in the display and there were even mentions of the creation of an all-metal body that would be able to transmit the signal. But these are matters we can only speculate about for now.

It sounds much more likely to say that Apple will use new products from Toshiba and SanDisk. The pair of companies presented the first ever 48-layer BiCS 3D flash memory, where one module has a size of 256Gb. And what does it actually mean? It is the fastest mobile 32GB storage available today and is also the most economical to ever appear in iPhone. The chips are manufactured using the 15-nm manufacturing process, which makes the storage significantly more economical compared to today's storage, and thanks to the 50% smaller dimensions, twice as much memory can fit on one module. The 3D technology has a big impact on the capacity as well as the speed of the storage, since there are three bits per transistor. Such a pleasure at the end is that the lowest storage capacity is 32GB and so it is likely that if Apple will use this repository in iPhone 7, toonečene deprives him of 16GB of memory in the basic version.

iPhone 7 concept wireless charging

*Source: BGR

Today's most read

.